Inside the Internet of Things - Bryon Moyer Blog
[From the last episode: There are many kinds of materials that you might want to add to a wafer, and there are many different ways of doing that.] Last time, we looked at adding materials to a wafer, and we used the generic meaning of deposition to cover all the […]
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[From the last episode: Building chips starts with a silicon wafer. From there you add and remove material with the assistance of photolithography.] This week’s piece is about what we called deposition in last week’s edition. “Deposition” actually means something more specific when processing silicon wafers, so, for the moment, […]
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[From the last episode: We will now turn our attention to the technologies that allow both sensors and actuators to be miniaturized.] We will, for the next few weeks, be looking at the basics of building computer chips. Except that we’ll be taking this in a direction other than computer […]
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[From the last episode: Amazon just had a glitch that sent a random conversation to a random contact.] This week we start our look at sensors and actuators. There’s lots of technology to talk about in order to make sense out of this. Before we get into that, why are […]
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[From the last episode: We looked at a review of what we’ve talked about since the beginning of the year.] Today we do an off-cycle posting due to a late-breaking story that relates to our recent discussion of the Big 3 – notably, Amazon. They’ve had a rather embarrassing problem […]
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